Important Considerations While Designing A Multi-Layer Board

 Important Considerations While Designing A Multi-Layer Board

This is the most important step in designing a multi-layer board. As the cost of the board rises proportional to the number of its layers, specifying the stackup at the start is essential, as this defines the optimum number of layers for the PCB. This also helps the designer/engineer to establish the characteristic impedances on the various layers. In actual practice, defining the PCB stackup/layer-count is often a trade-off with the fabrication processes, through which the designer/engineer tries to achieve the desired reliability, cost targets, and yield. For the designer to understand the PCB stackup, it is necessary for them to know how manufacturers build up a multilayer PCB.

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Taking Care of Warpage and Thermal Profile Issues during Assembly

 A warped printed circuit board (PCB) is one that does not sit true on a flat desktop. Although there are several reasons as to why this should happen, there are two specific causes that cause board warping. One of them is layout related, while the other is process related. If the PCB is found to be warped before the start of assembly, the problem has occurred between layout and fabrication. If the PCB was flat before, but was found warped after assembly, then the problem is likely between fabrication and assembly. However, some fabrication problems will not show up until the PCB has passed through the reflow oven.

Settling on the root cause is generally an iterative process. To discuss the issue with the fabrication or assembly shop, collecting some additional information is necessary. This could be the amount of warpage per inch, size of the board, and its thickness. Along with this information, it may be necessary to consider copper pours, placement of components, and their sizes, provided the board design is in-house.

With the above information, a discussion with the design house, fabrication, or the assembly shop may serve to highlight the issue and cause of the warpage. Once the design issue is ruled out, it may be necessary to determine if it relates to fabrication or assembly, which leads to the next step of determining a solution to the problem.

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